Electronic device

ABSTRACT

An electronic device is provided in this disclosure. In some embodiments, the electronic device includes a first substrate and a second substrate adjacent to the first substrate. In some embodiments, the electronic device includes a plurality of organic light emitting diodes, a filter layer, and a third substrate. At least a part of the plurality of organic light emitting diodes are disposed on the first substrate. The filter layer is disposed at least on the second substrate. The third substrate is disposed corresponding to the first substrate and the second substrate. The plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 17/107,856, filed on Nov. 30, 2020. The content of the applicationis incorporated herein by reference.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to an electronic device, and moreparticularly, to an electronic device including a filling element.

2. Description of the Prior Art

Flat display panels have been widely used in electronic devices such asmobile phones, televisions, monitors, tablet computers, and desktopcomputers. However, because of the limitation of the process apparatusand the size of the process substrate, many large-area displays (such asoutdoor display boards) cannot be formed using only a single displaypanel, but multiple display panels have to adjoin one another to providea larger display performance. The overall visual effect tends to beinfluenced by the gap between the tiled display panels, so how toimprove the display effect and/or related characteristics of the tileddisplay device through the design of materials and/or structure is thedirection of development in related fields.

SUMMARY OF THE DISCLOSURE

It is one of the objectives of the present disclosure to provide anelectronic device. A filling element is disposed between adjoineddisplay panels or adjoined light emitting plates for improving relatedperformance of the electronic device.

An electronic device is provided in this disclosure. In someembodiments, the electronic device includes a first substrate and asecond substrate adjacent to the first substrate. In some embodiments,the electronic device includes a plurality of organic light emittingdiodes, a filter layer, and a third substrate. At least a part of theplurality of organic light emitting diodes are disposed on the firstsubstrate. The filter layer is disposed at least on the secondsubstrate. The third substrate is disposed corresponding to the firstsubstrate and the second substrate. The plurality of organic lightemitting diodes and the filter layer are disposed under the thirdsubstrate.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top-view schematic diagram illustrating an electronic deviceaccording to an embodiment of the present disclosure.

FIG. 2 is a top-view schematic diagram illustrating an electronic deviceaccording to another embodiment of the present disclosure.

FIG. 3 is a top-view schematic diagram illustrating an electronic deviceaccording to a first embodiment of the present disclosure.

FIG. 4 is a cross-sectional diagram taken along a line A-A′ in FIG. 3 .

FIG. 5 is a cross-sectional schematic diagram illustrating an electronicdevice according to a second embodiment of the present disclosure.

FIG. 6 is a cross-sectional schematic diagram illustrating an electronicdevice according to a third embodiment of the present disclosure.

FIG. 7 is a cross-sectional schematic diagram illustrating an electronicdevice according to a fourth embodiment of the present disclosure.

FIG. 8 is a cross-sectional schematic diagram illustrating an electronicdevice according to a fifth embodiment of the present disclosure.

FIG. 9 is a cross-sectional schematic diagram illustrating an electronicdevice according to a sixth embodiment of the present disclosure.

FIG. 10 is a cross-sectional schematic diagram illustrating anelectronic device according to a seventh embodiment of the presentdisclosure.

FIG. 11 is a cross-sectional schematic diagram illustrating anelectronic device according to an eighth embodiment of the presentdisclosure.

DETAILED DESCRIPTION

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, equipment manufacturers may refer to a component bydifferent names. This document does not intend to distinguish betweencomponents that differ in name but not function. In the followingdescription and in the claims, the terms “include” and “comprise” areused in an open-ended fashion, and thus should be interpreted to mean“include, but not limited to . . . ”.

It will be understood that when an element or layer is referred to asbeing “on” or “connected to” another element or layer, it can bedirectly on or directly connected to the other element or layer, orintervening elements or layers may be presented (indirectly). Incontrast, when an element is referred to as being “directly on” or“directly connected to” another element or layer, there are nointervening elements or layers presented.

Herein, the terms “about”, “approximately”, “substantially”, and“essentially” usually mean within 10%, or within 5%, or within 3%, or 2%or within 1%, or within 0.5% of a given value or range. The quantitygiven here is an approximate quantity, that is, the meaning of “about”,“approximately”, “substantially”, and “essentially” can still be impliedwithout specifying the terms “about”, “approximately”, “substantially”,and “essentially”. In addition, the terms “a range from a first value toa second value” and “a range between a first value and a second value”indicate that the range includes the first value, the second value, andother values in between.

The ordinal numbers, such as “first”, “second”, etc., used in thedescription and the claims are used to modify the elements in the claimsand do not themselves imply and represent that the claim has anyprevious ordinal number, do not represent the sequence of some claimedelement and another claimed element, and do not represent the sequenceof the manufacturing methods. The use of these ordinal numbers is onlyused to make a claimed element with a certain name clear from anotherclaimed element with the same name.

It should be understood that embodiments are described below toillustrate different technical features, but these technical featuresmay be mixed to be used or combined with one another in different wayswithout conflicting with one another.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a top-view schematicdiagram illustrating an electronic device according to an embodiment ofthe present disclosure, and FIG. 2 is a top-view schematic diagramillustrating an electronic device according to another embodiment of thepresent disclosure. As shown in FIG. 1 , in some embodiments, displaypanels DP may be arranged repeatedly and adjoin one another in a firstdirection D1 and a second direction D2 for forming n times m displaypanels DP adjoining one another, wherein n and m may be positiveintegers greater than or equal to 2 respectively. In some embodiments,the first direction D1 and the second direction D2 may be substantiallyperpendicular to each other, and a third direction D3 may be orthogonalto the first direction D1 and the second direction D2 respectively. Theadjoined display panels DP may not overlap one another in the thirddirection D3, and the third direction D3 may be regarded as a thicknessdirection of the electronic device, but not limited thereto. As shown inFIG. 2 , in some embodiments, there may be only two display panels DParranged repeatedly and adjoining each other in the second direction D2,and there may be n display panels DP arranged repeatedly and adjoiningone another in the first direction D1 for forming 2n display panels DPadjoining one another, wherein n may be a positive integer greater thanor equal to 2. In this situation, border regions BR of the displaypanels DP may be disposed at opposite sites in the second direction D2for providing space for related wirings and/or space for being bondedwith other components (such as circuit boards), but not limited thereto.In other words, each of the display panels DP may be a three-sideborderless display panel or a four-side borderless display panel, butnot limited thereto. It is worth noting that the electronic device inthe present disclosure is not limited to the adjoining and arrangementapproaches shown in FIG. 1 and FIG. 2 described above, and the adjoiningand arrangement approaches shown in FIG. 1 and FIG. 2 may also beapplied in other embodiments of the present disclosure.

Please refer to FIG. 3 and FIG. 4 . FIG. 3 is a top-view schematicdiagram illustrating an electronic device according to a firstembodiment of the present disclosure, and FIG. 4 is a cross-sectionaldiagram taken along a line A-A′ in FIG. 3 . As shown in FIG. 3 and FIG.4 , an electronic device 101 is provided in this embodiment, and theelectronic device 101 includes two display panels DP, a filling element52, and a filling element 54. The two display panels DP adjoin eachother. The filling element 52 and the filling element 54 are disposedbetween the two display panels DP, and a material of the filling element52 is different from a material of the filling element 54.

Specifically, in some embodiments, the two display panels DP may bedisposed adjacent to each other and adjoining each other in the firstdirection D1, a gap G may exist between the two display panels DP, andthe filling element 52 and the filling element 54 may be disposed in thegap G. In some embodiments, each of the display panels DP may include aplurality of pixel regions PX for generating corresponding color lightand presenting display effects. The pixel regions which are not adjacentto the gap G may be regarded as first pixel regions PX1, and the pixelregions adjacent to the gap G may be regarded as second pixel regionsPX2. In some embodiments, the dimension of the second pixel region PX2may be adjusted for reducing the influence of the gap G between the twodisplay panels DP on the appearance of the electronic device 101. Forexample, a width W1 of each of the first pixel regions PX1 in the firstdirection D1 may be different from a width W2 of each of the secondpixel regions PX2 in the first direction D1. In some embodiments, thewidth W2 of each of the second pixel regions PX2 in the first directionD1 may be less than the width W1 of each of the first pixel regions PX2in the first direction D1 for reducing a distance between center pointsof two second pixel regions PX2 adjacent to each other in the firstdirection D1 and belonging to different display panels DP, and theinfluence of the gap G on the appearance of the electronic device 101and/or the display operation of the electronic device may be reducedaccordingly. In some embodiments, the width W1 of the first pixel regionPX1 in the first direction D1 may be substantially equal to the sum ofhalf a width W3 of the gap G in the first direction D1 and the width W2of the second pixel region PX2 in the first direction D1 (W1=W2+0.5*W3),but not limited thereto.

In some embodiments, the filling element 52 and the filling element 54may have different characteristics due to different materials forproviding different functions. For example, a water vapor transmissionrate (WVTR) of the filling element 52 is lower than or equal to a watervapor transmission rate of the filling element 54, and an opticaldensity (OD) of the filling element 52 is higher than or equal to anoptical density of the filling element 54, but the present disclosure isnot limited to this and the material composition of the filling element52 and the material composition of the filling element 54 may bemodified respectively according to design needs for generatingdifferences between the filling element 52 and the filling element 54 inother properties (such as refractive index, adhesion, and so forth).

In some embodiments, each of the display panels DP may include a lightemitting plate 10 and a protection substrate 20. At least a portion ofthe filling element 52 may be disposed between the two light emittingplates 10 of the two display panels DP, and at least a portion of thefilling element 54 may be disposed between the two protection substrates20 of the two display panels DP, but the present disclosure is notlimited to this. In other embodiments of the present disclosure, thedisplay panel DP may also be formed with other structures according todesign needs. In some embodiments, each of the light emitting plates 10may include a first substrate 12 and a plurality of light emittingelements 16. The light emitting elements 16 are disposed on the firstsubstrate 12, and the display elements 16 may be disposed incorresponding pixel regions PX respectively. For convenience, one lightemitting element 16 of each of the display panels DP is illustrated inFIG. 4 , but each of the pixel regions PX in FIG. 3 may include at leastone light emitting element 16, and each of the display panels DP mayinclude a plurality of the light emitting elements 16 disposed on thefirst substrate 12 accordingly. In some embodiments, each of the lightemitting plates 10 may further include a circuit structure 14 disposedon the first substrate 12, the light emitting element 16 may beelectrically connected with the circuit structure 14 via a connectionstructure 17, and the circuit structure 14 may include a drivingstructure, such as a thin film transistor (TFT) array, and/or othersuitable circuit units. It is worth noting that the circuit structure 14shown in each figure of the present disclosure is only for illustrationand not limited to a single-layer structure, and the distribution of thecircuit structure 14 on the first substrate 12 may be modified accordingto design needs.

In some embodiments, each of the light emitting elements 16 may includea self-luminous light emitting element, a non-self-luminous lightemitting element with a backlight module, or other suitable types oflight emitting structures. The self-luminous light emitting elementdescribed above may include but is not limited to a light emitting diode(LED) element, and the light emitting diode may include a sub-millimeterlight emitting diode (mini-LED), a micro light emitting diode(micro-LED), an organic light emitting diode (OLED), a quantum dot lightemitting diode (QD-LED), or a combination thereof, and thenon-self-luminous light emitting element described above may include butis not limited to a liquid crystal display element, a MEMS displayelement, or other suitable structures.

In some embodiments, each of the protection substrates 20 may include asecond substrate 22 and optionally include a color conversion layer 26disposed on the second substrate 22. Each of the light emitting elements16 may be disposed corresponding to the color conversion layer 26 in thethird direction D3 for emitting light towards the protection substrate20, and the light from the light emitting element 16 may be converted orfiltered into the desired color light by the color conversion layer 26in the protection substrate 20 and emitted outward to form a displayeffect. In some embodiments, a width of the light emitting element 16(such as a width W4 in the first direction D1 shown in FIG. 4 ) may besubstantially equal to or different from a width of the correspondingcolor conversion layer 26 (such as a width W5 in the first direction D1shown in FIG. 4 ) according to design needs. The material of the firstsubstrate 12 and the material of the second substrate 22 may includeglass, plastic, polymer material, such as polyimide (PI), polyethylenenaphthalate (PEN), polycarbonate (PC), polyurethane,polydimethylenesiloxane, and/or polyethylene terephthalate (PET), atleast one of the materials mentioned above, a mixture of the materialsmentioned above, or other suitable materials. In addition, the firstsubstrate 12 may be disposed corresponding to the second substrate 22 inthe third direction D3, the first substrate 12 may have two oppositesurfaces in the third direction D3 (such as surface S1 and a surface S2shown in FIG. 4 ), and the second substrate 22 may have two oppositesurfaces in the third direction D3 (such as surface S5 and a surface S6shown in FIG. 4 ). The surface S2 of the first substrate 12 may berelatively closer to the second substrate 22, the surface S1 of thefirst substrate 12 may be relatively far away from the second substrate22, the surface S5 of the second substrate 22 may be relatively closerto the first substrate 12, and the surface S6 of the second substrate 22may be relatively away from the first substrate 12, but not limitedthereto. The circuit structure 14 and the light emitting element 16 maybe disposed on the surface S2 of the first substrate 12, and the colorconversion layer 26 may be disposed on the surface S5 of the secondsubstrate 22.

In some embodiments, each of the display panels DP may further includean isolation structure (such as a first isolation structure 24 shown inFIG. 4 ) and a protection layer 30. The first isolation structure 24 maybe disposed on the surface S5 of the second substrate 22 and surroundthe color conversion layer 26, and the first isolation structure 24 mayprovide light-shielding effect and/or banking effect, but not limitedthereto. In addition, the protection layer 30 may cover the lightemitting element 16 and at least a portion of the protection layer 30may be disposed between the light emitting element 16 and the colorconversion layer 26 corresponding to this light emitting element 16 forproviding protection effect and/or effect of bonding the light emittingplate 10 and the protection substrate 20, but not limited thereto. Insome embodiments, the first isolation structure 24 may include anorganic material, an inorganic material, an organic/inorganic hybridmaterial, the above-mentioned materials doped with black pigment and/orblack particles, or other suitable isolation materials, and theprotection layer 30 may include optical clear resin (OCR), optical clearadhesive (OCA), or other suitable materials.

In some embodiments, each of the color conversion layers 26 may includea first material layer 26A and a second material layer 26B, and thefirst material layer 26A may be disposed between the second materiallayer 26B and the second substrate 22 in the third direction D3. In someembodiments, the second material layer 26B may include aphotoluminescence layer, and the first material layer 26A may include acolor filtering layer, but not limited thereto. The photoluminescencelayer described above may include a photoluminescence material, such asa quantum dot material, a fluorescent material, or other suitablephotoluminescence materials, and the color filtering layer describedabove may include a color filtering material, such as color resist, orother suitable color filtering structures, but not limited thereto. Insome embodiments, the light emitted from the light emitting element 16may excite the photoluminescence material in the second material layer26B for emitting light of different colors. The light emitted from thesecond material layer 26B and/or the light passing through the secondmaterial layer 26B may be filtered by the color filtering material inthe first material layer 26A for making the required light (such aslight within a specific wavelength range) pass through the secondsubstrate 22 and exit from the surface S6 of the second substrate 22,and the surface S6 of the second substrate 22 may be regarded as adisplay surface, but not limited thereto. In some embodiments, the lightemitting element 16 may include a light emitting diode configured toemit blue light, the second material layer 26B may include a quantum dotmaterial capable of being excited by blue light for generating othercolors of light (such as red light or green light), and the firstmaterial layer 26A may include red color resist, green color resist,blue color resist, or a color filtering material of other requiredcolors, but not limited thereto.

It is worth noting that the structure of the light emitting plate 10 andthe structure of the protection substrate 20 in the present disclosureare not limited to the condition described above and the condition shownin FIG. 4 , and the light emitting plate 10 and the protection substrate20 may be formed with other structures according to design needs.Additionally, in some embodiments, the filling element 54 may bedisposed on the filling element 52 in the third direction D3, and thefilling element 52 and the filling element 54 may directly contact thedisplay panels DP respectively or not. Therefore, the filling element 52and the filling element 54 may be disposed in the gap G between the twodisplay panels DP adjoining each other, but the gap G is not limited tobeing fully filled with the filling element 52 and the filling element54. In some embodiments, the optical density of the filling element 52may be higher than the optical density of the filling element 54 forimproving the interference between light from the light emittingelements 16 of different display panels DP, but not limited thereto. Forexample, the optical density of the filling element 52 may be higherthan or equal to 2, such as being higher than or equal to 2 and lowerthan or equal to 6, and the optical density may be the logarithm of theratio of incident light to transmitted light when the object ismeasured. In some embodiments, the water vapor transmission rate of thefilling element 54 may be lower than the water vapor transmission rateof the filling element 52. In other words, the water vapor resistance ofthe filling element 54 may be higher than the water vapor resistance ofthe filling element 52 for enhancing the water vapor blockingperformance at the gap G between the two display panels DP adjoiningeach other. For example, the water vapor transmission rate of thefilling element 54 may be lower than or equal to 2 g/m²/day, or thewater vapor transmission rate of the filling element 54 may be lowerthan or equal to 10E−2 g/m²/day for enhancing the water vapor resistanceand reducing the penetration of water vapor into the color conversionlayer 26 and/or the light emitting element 16, which may affect the lifespan and/or the reliability thereof. In some embodiments, the fillingelement 52 may include an adhesive material (such as silicone, acrylicgel, an epoxy-based material, or a mixed resin), a black pigment mixedwith the adhesive material, black particles (such as carbon black),other materials capable of enhancing the optical density, or othersuitable filling materials, and the filling element 54 may includesilicone, an epoxy resin, a phenolic resin, a mixed resin, or othersuitable filling materials. In some embodiments, the water vaporresistance of the material may be influenced by adding the material forenhancing the optical density (such as the black pigment and/or theblack particles described above) to the material, and the materialcomposition of the filling element 52 and the material composition ofthe filling element 54 described above may be adjusted according totheir locations and the relatively required material characteristics atthese locations for making the filling element 52 and the fillingelement 54 have different material compositions and differentcharacteristics. Additionally, in some embodiments, a refractive indexof the filling element 54 may be similar to a refractive index of thesecond substrate 22, or the refractive index of the filling element 54may be lower than the refractive index of the second substrate 22 forreducing the influence of the filling element 54 on the appearance ofthe electronic device 101 and/or the display operation of the electronicdevice 101.

In some embodiments, a top surface of the filling element 52 (such as asurface S7 shown in FIG. 4 ) may be higher than or aligned with asurface of the first isolation structure 24 facing the light emittingplate 10 (such as a surface S3 shown in FIG. 4 ) in the third directionD3 for avoiding the light emitting interference between the lightemitting elements 16 of different display panels DP, which may begenerated by the space between the filling element 52 and the firstisolation structure 24, wherein the being aligned in this disclosureonly refers to being roughly aligned, and some slight errors may betolerated. It is worth noting that, in the present disclosure, therelative height of the surface in the third direction D3 may be comparedby taking the surface D1 of the first substrate 12 as a reference, theposition relatively closer to the surface S1 of the first substrate 12may be regarded as a lower position in the third direction D3, and theposition relatively away from the surface S1 of the first substrate 12may be regarded as an upper position in the third direction D3. In otherwords, a height H of the filling element 52 in the third direction D3(may also be regarded as a length of the filling element 52 in the thirddirection D3) may be greater than or equal to a height H1 marked in FIG.4 , and the height H1 may be regarded as a distance between the surfaceS1 of the first substrate 12 and the surface S3 of the first isolationstructure 24 in the third direction D3, but not limited thereto.Additionally, in some embodiments, a top surface of the filling element54 (such as a surface S8 shown in FIG. 4 ) may be aligned with orslightly lower than the surface S6 of the second substrate 22 in thethird direction D3, but not limited thereto. In some embodiments, thesurface S8 of the filling element 54 may include a flat surface, acurved surface, or a rough surface. In addition, a surface of the colorconversion layer 26 facing the light emitting plate 10 (such as asurface S4 shown in FIG. 4 , and the surface S4 may also be regarded asa surface of the second material layer 26B facing the light emittingplate 10) may include a flat surface, a convex surface, a concavesurface, or a surface with other configurations. In some embodiments,the surface S4 of the color conversion layer 26 may be substantiallyaligned with the surface S3 of the first isolation structure 24 in thethird direction D3, but not limited thereto.

It is worth noting that the features of the electronic device in thepresent disclosure can also be applied to other types of electronicdevices, such as smart windows, antennas, and touch devices. Forexample, the non-self-luminous display elements in the light emittingplate may be replaced by other working medium layers, and the workingmedium layer may include, for example, liquid crystal for liquid crystalantennas, liquid crystal for liquid crystal windows or other workingmediums with specific and required functions.

The following description will detail the different embodiments of thepresent disclosure. To simplify the description, the followingdescription will detail the dissimilarities among different embodimentsand the identical features will not be redundantly described. Inaddition, identical components in each of the following embodiments aremarked with identical symbols for making it easier to understand thedifferences between the embodiments. The features in each of theembodiments may be mixed or combined without departing from the spiritof the present disclosure or conflicting with each other.

Please refer to FIG. 5 . FIG. 5 is a cross-sectional schematic diagramillustrating an electronic device 102 according to a second embodimentof the present disclosure. As shown in FIG. 5 , in some embodiments, theelectronic device 102 may further include an encapsulation material 40disposed between the filling element 52 and each of the display panelsDP and disposed between the filling element 54 and each of the displaypanels DP. In some embodiments, before tiling the display panels DP, theencapsulation material 40 may be formed on at least one lateral side ofthe display panel DP for edge sealing and enhancing the protectionperformance. In some embodiments, the encapsulation material 40 mayinclude a single layer or multiple layers of an organic material, aninorganic material, an organic/inorganic hybrid material, or othersuitable material compositions. For example, the encapsulation material40 may include an inorganic-organic-inorganic (IOI) composite material,wherein the inorganic material may include silicon oxide, siliconnitride, silicon oxynitride, or other suitable inorganic encapsulationmaterials, and the organic material may include organic resin or othersuitable organic encapsulation materials. In some embodiments, the watervapor transmission rate of the encapsulation material 40 may be lowerthan the water vapor transmission rate of the filling element 52 forimproving the water vapor resistance applied to the display panel DP,but not limited thereto.

Additionally, in some embodiments, the first isolation structure 24 mayinclude a first portion 24A and a second portion 24B. The first portion24A is disposed between the second portion 24B and the second substrate22, and a material of the first portion 24A may be different from amaterial of the second portion 24B. For example, the first portion 24Aof the first isolation structure 24 may be used to provide lightshielding effect, and the second portion 24B of the first isolationstructure 24 may be used to provide banking effect. Therefore, theoptical density of the first portion 24A may be higher than that of thesecond portion 24B, and the first portion 24A may include black matrixresist or other materials with relatively higher optical density, forexample, but not limited thereto. In some embodiments, the surface S4 ofthe color conversion layer 26 facing the light emitting plate 10 may bea convex surface protruding towards the light emitting element 16, andthe surface S4 of the color conversion layer 26 may be lower than thesurface S3 of the first isolation structure 24 in the third direction D3accordingly, but not limited thereto. In some embodiments, the width W4of the light emitting element 16 may be greater than the width W5 of thecorresponding color conversion layer 26, but not limited thereto. Insome embodiments, the surface S8 of the filling element 54 may be acurved surface protruding outwards, and the filling element 54 may bepartially disposed on the encapsulation material 40 in the thirddirection D3, but not limited thereto.

In some embodiments, the top surface of the filling element 52 (such asthe surface S7) may be lower than or aligned with a surface of thesecond substrate 22 facing the light emitting plate 10 (such as thesurface S5) in the third direction D3 for avoiding the light emittinginterference between the light emitting elements 16 of different displaypanels DP, which may be generated by the portion with relatively loweroptical density in the first isolation structure 24 (such as the secondportion 24B). In other words, the height H of the filling element 52 inthe third direction D3 may be greater than or equal to a height H2marked in FIG. 5 , and the height H2 may be regarded as a distancebetween the surface S1 of the first substrate 12 and the surface S5 ofthe second substrate 22 in the third direction D3, but not limitedthereto. As shown in FIG. 4 and FIG. 5 , in some embodiments, the heightH of the filling element 52 in the third direction D3 may range from theheight H1 marked in FIG. 4 and the height H2 marked in FIG. 5 . In otherwords, the surface S7 of the filling element 52 may be higher than oraligned with the surface S3 of the first isolation structure 24 facingthe light emitting pate 10 in the third direction D3 and lower than oraligned with the surface S5 of the second substrate 22 facing the lightemitting plate 10 in the third direction D3, but not limited thereto. Itis worth noting that the technical features of the electronic device 102in this embodiment that are different from the electronic device 101shown in FIG. 4 may also be applied to other embodiments of the presentdisclosure according to design needs.

Please refer to FIG. 6 . FIG. 6 is a cross-sectional schematic diagramillustrating an electronic device 103 according to a third embodiment ofthe present disclosure. As shown in FIG. 6 , the electronic device 103includes the protection substrate 20, two light emitting plates 10, anda filling element (such as the filling element 52). The two lightemitting plates 10 adjoin each other and are disposed corresponding tothe protection substrate 20, and the two light emitting plates 10 emitlight towards the protection substrate 20. The filling element 52 isdisposed between the two light emitting plates 10. It should be notedthat, each of the two light emitting plates 10 comprises a firstsubstrate 12 and light emitting elements 16 disposed on the firstsubstrate 12, and the protection substrate 20 comprises a secondsubstrate 22 and a color conversion layer 26 disposed on the secondsubstrate 22. In other words, in some embodiments, a plurality of thelight emitting plates 10 may be disposed corresponding to the sameprotection substrate 20, and the filling element 52 may be locatedbetween the light emitting plates 10 adjoining one another in ahorizontal direction (such as the first direction D1) and located underthe protection substrate 20 (such as the first isolation structure 24 inthe protection substrate 20) in a vertical direction (such as the thirddirection D3). In some embodiments, the surface S7 of the fillingelement 52 may directly contact the surface S3 of the first isolationstructure 24, but not limited thereto. In the configuration describedabove, the optical density of the filling element 52 may be higher thanor equal to 2, such as being higher than or equal to 2 and lower than orequal to 6, for improving the light emitting interference between thelight emitting elements 16 of different display panels DP, but notlimited thereto. Additionally, in some embodiments, the width of thecolor conversion layer 26 may be greater than the width W4 of thecorresponding light emitting element 16 for increasing the area of thecolor conversion layer 26 in each pixel region, but not limited thereto.In some embodiments, the surface S4 of the color conversion layer 26facing the light emitting plate 10 may be a concave surface towards thesecond substrate 22, and at least a portion of the surface S4 of thecolor conversion layer 26 may be higher than the surface S3 of the firstisolation structure 24 in the third direction D3 accordingly, but notlimited thereto. In some embodiments, the manufacturing method of theelectronic device 103 may include but is not limited to combining thelight emitting plates 10 and the protection substrate 20 (such as usingthe protection layer 20 for bonding, but not limited thereto) first andforming the filling element 52 in the gap between the light emittingplates 10 subsequently. It is worth noting that the technical featuresof the electronic device 103 in this embodiment that are different fromthe electronic device 101 shown in FIG. 4 may also be applied to otherembodiments of the present disclosure according to design needs.

Please refer to FIG. 7 . FIG. 7 is a cross-sectional schematic diagramillustrating an electronic device 104 according to a fourth embodimentof the present disclosure. As shown in FIG. 7 , in the electronic device104, at least a portion of the surface S5 of the second substrate 22 maynot be covered by the color conversion layer 26 or the first isolationstructure 24, at least a portion of the light entering the electronicdevice 104 from the surface S1 of the first substrate 12 may passthrough the electronic device 104 and emit outwards from the surface S6of the second substrate 22, and each of the display panels DP under thisconfiguration may be regarded as a transparent display panel, but notlimited thereto. In some embodiments, the first isolation structure 24may extend from the surface S5 of the second substrate 22 towards thefirst substrate 12 and surround at least a portion of the correspondinglight emitting element 16 for improving the light emitting interferencebetween the light emitting elements 16 of different display panels DP,especially when the optical density of the first isolation structure 24is relatively higher (such as higher than or equal to 2), but notlimited thereto, wherein the surrounding an object in this disclosuremay refer to being disposed at the periphery of the object, but notlimited thereto. In addition, with the design of the first isolationstructure 24 described above, the width W5 of the color conversion layer26 may be greater than the width W4 of the corresponding light emittingelement 16, and the surface S3 of the first isolation structure 24 maybe lower than the surface S4 of the color conversion layer 26 and thetop surface (such as the topmost surface) of the light emitting element16 in the third direction D3, but the surface S3 of the first isolationstructure 24 may not directly contact the first substrate 12 or thecircuit structure 14 on the first substrate 12, but not limited thereto.In some embodiments, with the first isolation structure 24 having higheroptical density and surrounding the light emitting element 16, thefilling element 54 may be disposed in the gap between the display panelsDP adjoining each other without disposing the filling element 52described above for improving the water vapor resistance performance,but not limited thereto. Additionally, in some embodiments, the surfaceS8 of the filling element 54 may include a curved and concave surface,and at least a portion of the surface S8 of the filling element 54 maybe lower than the surface S6 of the second substrate 22 in the thirddirection D3 accordingly, but not limited thereto. It is worth notingthat the technical features of the electronic device 104 in thisembodiment that are different from the electronic device 101 shown inFIG. 4 may also be applied to other embodiments of the presentdisclosure according to design needs.

Please refer to FIG. 8 . FIG. 8 is a cross-sectional schematic diagramillustrating an electronic device 105 according to a fifth embodiment ofthe present disclosure. As shown in FIG. 8 , in the electronic device105, at least a portion of the surface S5 of the second substrate 22 isnot covered by the color conversion layer 26 or the first isolationstructure 24, at least a portion of the light entering the electronicdevice 105 from the surface S1 of the first substrate 12 may passthrough the electronic device 105 and emit outwards from the surface S6of the second substrate 22, and each of the display panels DP under thisconfiguration may be regarded as a transparent display panel, but notlimited thereto. In some embodiments, the first isolation structure 24may extend from the surface S5 of the second substrate 22 towards thefirst substrate 12 and surround at least a portion of the correspondinglight emitting element 16 for improving the light emitting interferencebetween the light emitting elements 16 of different display panels DP,especially when the optical density of the first isolation structure 24is relatively higher (such as higher than or equal to 2), but notlimited thereto. In addition, with the design of the first isolationstructure 24 described above, the width W5 of the color conversion layer26 may be greater than the width W4 of the corresponding light emittingelement 16, the surface S3 of the first isolation structure 24 may belower than the surface S4 of the color conversion layer 26 and the topsurface (such as the topmost surface) of the light emitting element 16in the third direction D3, and the surface S3 of the first isolationstructure 24 may contact the circuit structure 14, but not limitedthereto. In some embodiments, with the first isolation structure 24having higher optical density and surrounding the light emitting element16, the filling element 54 may be disposed in the gap between thedisplay panels DP adjoining each other without disposing the fillingelement 52 described above for improving the water vapor resistanceperformance, but not limited thereto. Additionally, in some embodiments,the electronic device 105 may further include the encapsulation material40 disposed between the filling element 54 and each of the displaypanels DP for further enhancing the water vapor resistance applied tothe display panel DP, but not limited thereto. In addition, the surfaceS8 of the filling element 54 may include a rough and concave surface,and at least a portion of the surface S8 of the filling element 54 maybe lower than the surface S6 of the second substrate 22 in the thirddirection D3 accordingly. When the surface S8 of the filling element 54is a rough surface, it may assist light scattering and reduce thevisibility of the gap in the electronic device for enhancing the visualeffect, but not limited thereto. It is worth noting that the technicalfeatures of the electronic device 105 in this embodiment that aredifferent from the electronic device 101 shown in FIG. 4 may also beapplied to other embodiments of the present disclosure according todesign needs.

Please refer to FIG. 9 . FIG. 9 is a cross-sectional schematic diagramillustrating an electronic device 106 according to a sixth embodiment ofthe present disclosure. As shown in FIG. 9 , in the electronic device106, the two light emitting plates 10 adjoin each other and are disposedunder the protection substrate 20 for emitting light towards theprotection substrate 20, and the filling element 54 may be disposedbetween the two light emitting plates 10. In other words, in someembodiments, a plurality of the light emitting plates 10 may be disposedcorresponding to the same protection substrate 20, and the fillingelement 54 may be located between the light emitting plates 10 adjoiningone another in a horizontal direction (such as the first direction D1).In some embodiments, the surface S8 of the filling element 54 maydirectly contact the surface S5 of the second substrate 22, but notlimited thereto. Additionally, in some embodiments, at least a portionof the surface S5 of the second substrate 22 is not covered by the colorconversion layer 26, the first isolation structure 24, or the fillingelement 54, at least a portion of the light entering the electronicdevice 106 from the surface S1 of the first substrate 12 may passthrough the electronic device 106 and emit outwards from the surface S6of the second substrate 22, and the electronic device 106 under thisconfiguration may be regarded as a transparent display device, but notlimited thereto. In the configuration described above, the fillingelement 54 may be a transparent material for enhancing the effect oftransparent display, but not limited thereto. Additionally, in someembodiments, the electronic device 106 may further include a secondisolation structure 18 disposed on the surface S2 of the first substrate12, and the second isolation structure 18 may surround the lightemitting element 16 in the horizontal direction (such as the firstdirection D1 and/or the second direction D2). In some embodiments, thematerial composition of the second isolation structure 18 may be similarto that of the first isolation structure 24, and the second isolationstructure 18 may be disposed corresponding to and connected with thefirst isolation structure 24 in the third direction D3, but not limitedthereto. In some embodiments, the manufacturing method of the electronicdevice 106 may include but is not limited to the following step. Afterforming the circuit structure 14, the light emitting elements 16, andthe second isolation structure 18 on the first substrate 12 and formingthe color conversion layer 26 and the first isolation structure 24 onthe second substrate 22, the protection substrate 20 and the lightemitting plates 10 are combined, and the filling element 54 is formed inthe gap between the light emitting plates 10 subsequently. It is worthnoting that the technical features of the electronic device 106 in thisembodiment that are different from the electronic device 101 shown inFIG. 4 may also be applied to other embodiments of the presentdisclosure according to design needs.

Please refer to FIG. 10 . FIG. 10 is a cross-sectional schematic diagramillustrating an electronic device 107 according to a seventh embodimentof the present disclosure. As shown in FIG. 10 , in the electronicdevice 107, at least a portion of the light emitting elements 16 mayemit light of different colors. In some embodiments, the light emittingelements 16 may include a first light emitting element 16-1 and a secondlight emitting element 16-2, and the color of light emitted by the firstlight emitting element 16-1 may be different from the color of lightemitted by the second light emitting element 16-2. For example, thefirst light emitting element 16-1 may be a red light emitting element(such as a red LED) configured to emit red light, and the second lightemitting element 16-2 may be a green light emitting element (such as agreen LED) configured to emit green light, but not limited thereto. Insome embodiments, the light emitting elements 16 may include lightemitting elements configured to emit light of different colors (such asa blue light emitting element, a yellow light emitting element, a whitelight emitting element, and so forth) according to design needs. Inaddition, it is not necessary to dispose the second material layer 26Bof the embodiment described above in the electronic device 107 becausethe light emitting elements 16 themselves may produce light of differentcolors, and the first material layer 26A may have different colorsaccording to the color of light emitted by the corresponding lightemitting element 16. For example, the first material layer 26A disposedcorresponding to the first light emitting element 16-1 may include a redresist material when the first light emitting element 16-1 is a redlight emitting element, and the first material layer 26A disposedcorresponding to the second light emitting element 16-2 may include agreen resist material when the second light emitting element 16-2 is agreen light emitting element, but not limited thereto. It is worthnoting that the technical feature of using the light emitting elementscapable of emitting light of different colors in the electronic device107 of this embodiment and the technical feature without disposing thesecond material layer in the color conversion layer in this embodimentmay also be applied to other embodiments of the present disclosureaccording to design needs.

Please refer to FIG. 11 . FIG. 11 is a cross-sectional schematic diagramillustrating an electronic device 108 according to an eighth embodimentof the present disclosure. As shown in FIG. 11 , in the electronicdevice 108, the two light emitting plates 10 adjoin each other and aredisposed under the second substrate 22 for emitting light towards thesecond substrate 22, and the filling element 54 may be disposed betweenthe two light emitting plates 10. In other words, in some embodiments, aplurality of the light emitting plates 10 may be disposed correspondingto the same second substrate 22, and the filling element 54 may belocated between the light emitting plates 10 adjoining one another in ahorizontal direction (such as the first direction D1). In someembodiments, the surface S8 of the filling element 54 may directlycontact the surface S5 of the second substrate 22, but not limitedthereto. In some embodiments, at least a portion of the light emittingelements 16 may emit light of different colors. For example, the lightemitting elements 16 may include the first light emitting element 16-1and the second light emitting element 16-2 described above, but notlimited thereto. In addition, it is not necessary to dispose the colorconversion layer 26 of the embodiment described above in the electronicdevice 108 because the light emitting elements 16 themselves may producelight of different colors, and the first isolation structure 24 mayextend from the surface S5 of the second substrate 22 towards the firstsubstrate 12 and surround at least a portion of the corresponding lightemitting element 16 for improving the light emitting interferencebetween different light emitting elements 16, but not limited thereto.In addition, with the design of the first isolation structure 24described above, the surface S3 of the first isolation structure 24 maybe lower than the top surface (such as the topmost surface) of the lightemitting element 16 in the third direction D3, but the surface S3 of thefirst isolation structure 24 may not directly contact the firstsubstrate 12 or the circuit structure 14 on the first substrate 12, butnot limited thereto. In some embodiments, with the first isolationstructure 24 having higher optical density and surrounding the lightemitting element 16, the filling element 54 may be disposed in the gapbetween the light emitting plates 10 adjoining each other withoutdisposing the filling element 52 described above for improving the watervapor resistance performance, but not limited thereto. Additionally, insome embodiments, at least a portion of the surface S5 of the secondsubstrate 22 is not covered by the first isolation structure 24 or thefilling element 54, at least a portion of the light entering theelectronic device 108 from the surface S1 of the first substrate 12 maypass through the electronic device 108 and emit outwards from thesurface S6 of the second substrate 22, and the electronic device 108under this configuration may be regarded as a transparent displaydevice, but not limited thereto. In the configuration described above,the filling element 54 may be a transparent material for enhancing theeffect of transparent display or reducing the visibility of the gap inthe electronic device, but not limited thereto. It is worth noting thatthe technical feature of using the light emitting elements capable ofemitting light of different colors in the electronic device 108 of thisembodiment and the technical feature without disposing the colorconversion layer in this embodiment may also be applied to otherembodiments of the present disclosure according to design needs.

To summarize the above descriptions, in the electronic device of thepresent disclosure, the filling element may be disposed between thedisplay panels adjoining one another or between the light emittingplates adjoining one another and the material composition of the fillingelement may be adjusted according to the location of the filling elementand the relatively required material characteristics at this locationfor improving the related performance of the electronic device, such asdisplay effect, life span and/or product reliability.

Although the embodiments and advantages thereof in the presentdisclosure have been disclosed as above, it should be understood thatanyone with ordinary knowledge in the related technical field can makechanges, substitutions, and decorations without departing from thespirit and the scope of this disclosure. Additionally, the scope of theprotected range of this disclosure is not limited to the processes,machines, manufacturing, material compositions, devices, methods, andsteps in the specific embodiments described in the description. Anyperson with ordinary knowledge in the related technical field mayunderstand the current or future development of processes, machines,manufacturing, material composition, devices, methods and steps from thedisclosed contents in this disclosure, as long as the substantially samefunctions carried out in the described embodiments or the substantiallysame results obtained in the described embodiments may be used inaccordance with the present disclosure. Therefore, the protection scopeof the present disclosure includes the above-mentioned processes,machines, manufacturing, material composition, devices, methods andsteps. Additionally, each claim constitutes a separate embodiment, andthe protection scope of the present disclosure also includes acombination of the claims and the embodiments. The protection scope ofthe present disclosure shall be determined by the scope of the claimslisted below.

The above description is only related to the embodiments of the presentinvention, but not used for limiting the present invention. Thoseskilled in the art will readily observe that the present invention mayhave numerous modifications and alterations. Any modifications,equivalents replacements, improvements, etc. made in the spirits andprinciples of the present invention should be construed as the appendedclaims of the present invention.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the disclosure. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. An electronic device, comprising: a first substrate and a second substrate adjacent to the first substrate; a plurality of organic light emitting diodes, wherein at least a part of the plurality of organic light emitting diodes are disposed on the first substrate; a filter layer disposed at least on the second substrate; and a third substrate disposed corresponding to the first substrate and the second substrate, wherein the plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.
 2. The electronic device according to claim 1, wherein the third substrate is overlapped with the first substrate and the second substrate.
 3. The electronic device according to claim 1, wherein a gap exists between the first substrate and the second substrate.
 4. The electronic device according to claim 1, further comprising: an adhesive element disposed on the second substrate.
 5. The electronic device according to claim 4, wherein a part of the adhesive element is disposed between the filter layer and the second substrate.
 6. The electronic device according to claim 1, further comprising: a circuit structure disposed on the first substrate, wherein the circuit structure is electrically connected with the at least a part of the plurality of organic light emitting diodes.
 7. The electronic device according to claim 6, wherein the circuit structure comprises a thin film transistor.
 8. The electronic device according to claim 1, further comprising: an isolation structure, wherein at least a part of the isolation structure is disposed on the second substrate and disposed adjacent to the filter layer.
 9. The electronic device according to claim 8, wherein the isolation structure comprises black matrix resist. 